HY-510 thermal compound enhances heat dissipation between chips and heatsinks. Great for CPUs, graphics cards, power ICs, and Raspberry Pi coolers.
Key Features:
- Thermal conductivity: ~1.93W/m·K
- Color: gray | Silicone-based formulation
- Non-conductive and non-corrosive
- Easy syringe application (5g or 10g tube)
Description:
Keep your components cool under load—this paste improves thermal transfer and long-term heat performance.
