Soldering Paste – No-Clean Flux Gel for SMD Rework and Surface Mount Soldering

This soldering flux paste improves solder flow and wetting for clean joints in SMD work. Perfect for reballing, IC replacement, and hot-air rework stations.

Key Features:

• No-clean formula with minimal residue
• Excellent spread and heat stability
• Can be applied via syringe or spatula
• Works with leaded and lead-free solder

Description:

Whether you’re hand-placing components or using a reflow oven, this paste ensures crisp, conductive joints that last.