This soldering flux paste improves solder flow and wetting for clean joints in SMD work. Perfect for reballing, IC replacement, and hot-air rework stations.
Key Features:
- No-clean formula with minimal residue
- Excellent spread and heat stability
- Can be applied via syringe or spatula
- Works with leaded and lead-free solder
Description:
Whether you’re hand-placing components or using a reflow oven, this paste ensures crisp, conductive joints that last.
